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德邦科技(688035)
融资融券更新时间:2025-07-18
指标2025-07-182025-07-172025-07-162025-07-152025-07-142025-07-112025-07-102025-07-092025-07-082025-07-072025-07-042025-07-032025-07-022025-07-012025-06-302025-06-272025-06-262025-06-252025-06-242025-06-23
融资余额(万元)20802.1820193.7920035.920414.292058220227.0920094.9518857.5218470.1418274.5418304.7318509.7918401.0219155.4118929.3518653.1517960.7617386.317663.6817578.81
融资买入额(万元)1692.541826.94988.761119.171030.151262.931611.45969.21922.73557.72860.63673.9531.691321.261236.722353.081617.921409.211266.591206.73
融资偿还额(万元)1084.151669.051367.141286.88675.251130.78374.03581.83727.13587.911065.69565.131286.081095.2960.511660.691043.471686.581181.72739.86
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)20802.1820193.7920035.920414.292058220227.0920094.9518857.5218470.1418274.5418304.7318509.7918401.0219155.4118929.3518653.1517960.7617386.317663.6817578.81
融资融券差额(万元)20802.1820193.7920035.920414.292058220227.0920094.9518857.5218470.1418274.5418304.7318509.7918401.0219155.4118929.3518653.1517960.7617386.317663.6817578.81
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